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TYLsemi

Firmware Architect

Posted 2 months ago
$150K - $300K per year
10+ years experience
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AI Summary

The Firmware Architect will lead the end-to-end firmware and embedded software architecture for TYL chiplets, overseeing both on-die and host-side components. They will also drive pre-silicon and post-silicon firmware development and collaborate with cross-functional teams and customers.

What you'll do

  • Firmware & Embedded Software Architecture Leadership 
  • Own the end-to-end firmware/embedded-software architecture for TYL chiplets.  
  • On-die: boot and secure boot, link sequencing, PCIe/CXL controller configuration and enumeration, address-translation (NTB/ATT) setup, MSI-X and AER handling, reset/FLR, power management, telemetry, and in-field firmware update.  
  • Host-side: kernel drivers, the device-virtualization/transparency shim (synthetic PCIe device, VFIO-mdev-class), management libraries/APIs, and IOMMU (VT-d/SMMU) coordination.  
  • Define the hardware/software boundary with architecture and RTL — datapath (credit, ordering, merge/split, address-translation execution) in RTL; control plane in firmware — and own register maps and UCIe sideband/mailbox protocols.  
  • Stay hands-on through first silicon. 

Bring-up, Methodology & Quality 

  • Drive pre-silicon firmware and host-software development on emulation, and virtual platforms, and lead post-silicon bring-up and debug.  
  • Stand up the firmware engineering infrastructure: CI, automated and HIL testing, requirements traceability, secure-development practices (secure boot, attestation, key management), and the RAS/error-handling and fault-attribution strategy.  
  • Define firmware release, quality, and security criteria across products and customers. 

Cross-functional & Customer Collaboration 

  • Be the technical bridge between firmware/software and architecture, RTL, PHY/IP vendors and program management — bringing software feasibility into hardware decisions early.  
  • Work directly with customers: compute-SoC partners on PCIe/CXL enablement, ATE/SLT integrators on the firmware and management libraries. 

Team Building & Management 

  • Set technical direction, roadmap, and clear subsystem ownership (boot/security, PCIe/CXL management, host drivers and virtualization, RAS/telemetry).  


What We're Looking For

  • BS/MS in Electrical / Computer Engineering or Computer Science 
  • 12+ years of embedded firmware development, with at least 5 years in silicon-level bring-up and validation of high-speed interface IPs. 
  • Expert-level C and assembly for resource-constrained embedded CPUs (RISC-V or Arm Cortex-M/R class); strong debugging skills using JTAG/OpenOCD, trace, and logic analysers. 
  • Deep PCIe expertise: link-training state machine, equalization (Gen3 EQ/LFSR, Gen4/5 preset search, Gen6/7 Flit Mode), speed-change sequences, LTSSM register-level behaviour. 
  • Hands-on experience with HPC compute SoC firmware ecosystems — UEFI/BIOS bring-up, ACPI table authoring, SMBus/I2C/MCTP platform management, VT-d/IOMMU configuration — on HPC platforms. 
  • Solid understanding of x86 server platform boot flow: SEC → PEI → DXE → BDS, PCIe enumeration in PEI/DXE, Option ROM interaction, and PCIe error-recovery paths (AER, DPC). 
  • Experience with secure-boot architectures, code-signing flows, and OTA update mechanisms on embedded targets. 
  • Comfortable working at the hardware-software boundary: reading RTL schematics, memory-mapped register specs, and waveforms from simulation or a logic analyser. 


Good To Have

  • CXL 2.0/3.0 firmware experience: HDM decoder programming, CXL IDE, DVSEC, BISnp coordination. 
  • UCIe / die-to-die sideband firmware experience (RDI/FDI parameter negotiation, sideband messaging). 
  • SPDM (DSP0274) and CMA device-attestation implementation experience. 
  • Familiarity with PLDM for firmware update (DSP0267) and platform telemetry (DSP0248). 
  • ATE scripting background — Teradyne UltraFLEX / Advantest T2000 board-level bring-up scripts. 
  • Exposure to chiplet packaging concepts (UCIe, EMIB, CoWoS) and multi-die power-sequencing considerations. 
  • Kernel-mode driver or UEFI DXE driver development experience. 

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