Test Engineer, Automotive Robotics

As part of Tenstorrent’s Automotive Robotics team, you will help design and deliver the core hardware modules inside our next generation chiplet based SoCs for automotive products. You will be the bridge between silicon design, DFT, OSAT partners, and customers to ensure our multi die SiP platforms meet aggressive performance, quality, and safety targets.

This role is remote, based in Munich, Germany.

We welcome candidates at various experience levels for this role. During the interview process, candidates will be assessed for the appropriate level, and offers will align with that level, which may differ from the one in this posting.

Who You Are

• Experienced with bringing ASICs from design phase through production ramp, managing wafer yield, and analyzing field failure rates.
• Able to translate system and safety requirements into concrete constraints on package architecture, DFT insertion, and ATE or SLT test content.
• Confident working directly with foundry, OSAT, and ATE vendors to debug issues.
• Comfortable working in a cross functional role that extends beyond DFT, including low power designs with multiple clock domains.

What We Need

• Define test strategy for multi chiplet packages from initial silicon through high volume production.
• 10+ years of experience working across multiple teams and multiple companies to coordinate test, yield, and quality efforts.
• Feed lessons learned back into next generation SiP architectures, DFT strategy, and test content.

What You Will Learn

• How to bring a SiP to high volume, automotive grade production.
• How chiplets, RISC V CPUs, AI accelerators, and die to die links come together in a unified automotive platform.
• How to trade off package architecture, DFT, and test cost to hit aggressive performance, quality, and reliability targets.

Tenstorrent offers a highly competitive compensation package and benefits, and we are an equal opportunity employer.