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Lead outsourced assembly and test engineering activities to drive NPI readiness, yield optimization, and cost improvements across a global supplier network. Manage strategic sourcing for advanced substrates and maintain executive-level relationships with Tier-1 OSAT partners.
Job Details:
Job Description:
Role Summary
We are seeking a highly skilled Senior OSAT Engineer to drive outsourced assembly and test engineering activities across Altera’s global supplier network. You will lead NPI readiness, yield optimization, cost improvements, and qualification activity for packaging and test flows supporting Altera’s FPGA/SoC product lineup. This role requires strong semiconductor backend engineering experience, hands-on problem solving, and the ability to collaborate closely with OSAT partners and cross-functional stakeholders.
Key Responsibilities
- Strategic Sourcing Strategy: Own the global commercial strategy for advanced substrates (FCBGA, high-density interconnects) and leading-edge OSAT packaging technologies.
- Value Engineering (VE): Lead cross-functional cost-optimization initiatives by analyzing advanced packaging design rules, substrate layer counts, and materials to strip out unnecessary manufacturing costs.
- Should-Cost Modeling: Build granular, bottom-up should-cost models for complex backend processes, including bump, wafer-level packaging, assembly, and final test.
- Technical Roadmap Alignment: Collaborate with internal hardware architecture teams and external silicon foundries to secure capacity for 2.5D/3D, Chiplets, and Co-Packaged Optics (CPO).
- Supplier & Yield Management: Manage executive-level relationships with Tier-1 OSATs and substrate suppliers, using Quarterly Business Reviews (QBRs) to drive continuous yield and price improvements.
- NPI & Risk Mitigation: Ensure early engagement during the New Product Introduction (NPI) phase to lock in resilient supply chains, multi-source critical components, and de-risk advanced technology ramps.
Qualifications:
Requirements & Qualifications
- Education: MBA or Master’s degree in Engineering.
- Technical Expertise: 10+ years of deep domain knowledge in advanced packaging (Flip Chip, Wafer-Level Packaging, 2.5D/3D IC, Silicon Interposers) and high-density substrate manufacturing.
- Value Engineering Track Record: Proven experience driving structural cost reductions through teardowns, alternative materials sourcing, manufacturing step optimization, or design-for-cost (DFC) practices.
- Sourcing Experience: 10+ years of high-tech supply chain experience negotiating high-value master services agreements (MSAs) and capacity reservation agreements with global OSATs.
- Analytical Skills: Advanced capability in financial modeling, cost accounting for semiconductors, and data-driven supplier scorecard management.
Job Type:
RegularShift:
Shift 1 (Taiwan)Primary Location:
Virtual TaiwanAdditional Locations:
Posting Statement:
All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.Automatically Apply to the Best Remote Jobs
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