Assembly and Packaging Process Engineer
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AI Summary
The role involves supporting the company's device packaging process improvements for New Product Introduction (NPI) and volume manufacturing by working closely with OSATs and Contract Manufacturers (CMs) in Asia. Key tasks include project tracking, writing technical reports, analyzing data, and supporting component and device level testing and reliability work.
About the role
- We are seeking an entry or middle level assembly and packaging Engineer with degree in Electrical Engineering, Photonics, Mechanical Engineer, or a related field.
What you'll do
- Work with our OSAT in Asia to support company device packaging process improvements for NPI and volume manufacture
- Work with our CMs (contract manufactures) in Asia to support our optical engine and subcomponent assembly and process improvement for NPI and volume manufacture
- Project tracking weekly.
- Write technical reports and present results.
- Analyze data and track OSATs, Assembly houses, contract manufacturers Cp and Cpk for internal use.
- Support tests and reliability work at component level CoC, device level, optical engine, and module system assembly.
- Maintain the software and firmware support for testing and relevant setups.
Required Qualifications
- Minimal requirement is a bachelor's degree with 1 years of experience.
- The successful candidate need have English communication capability.
- Experience or knowledge of PCB assembly with SMT line
- Hands-on experience in laboratory experimentation and data analysis
- English communication capability is a must.
- Familiar with Microsoft Office.
- Fast learner is a must.
- Good work ethics and Maintain company confidential information are a must
Preferred Qualifications
- Higher degree with more experience is highly desired.
- Experience with microelectronic device packaging.
- Former experience of optical device packaging is highly desirable.
- Experience with hands-on testing of photonic and electronic. device/components.
- Device test knowledge and experience for at least some following areas for: IIIV CoC, wafer level probe test, packaged electro-optical devices, assembly modules, PCBA.
- Knowledge and experience in at least some following processes: IIIV or CMOS wafer level process; IIIV bar level processes; device packaging processes such as die attach, flip chip, wire bonding, and module mechanical assembly processes, particularly camera and lidar module assembly.
- Experience in SolidWorks and familiar with Engineering drawing is a plus.
- Data analysis experience such as JMPs is a plus; excel is OK.
- Programming and software maintenance skills are desired eg. python, or C++
- Understanding the microelectronic reliability tests and mechanical reliability tests are desirable.
- Experience in microsystem assembly such as hard disk assembly is a plus.
Benefits (subject to location and local regulations)
- Competitive salary and equity
- Comprehensive medical, dental, and vision coverage
- 401(k) retirement plan
- Flexible vacation and time-off policy
- Collaborative, fast-paced, and inclusive work environment
- Opportunity to work on cutting-edge technologies with a highly cross-functional team
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