Please mention DailyRemote when applying
See how much of this job your resume covers, and what’s missing.
Want a recruiter to go through it line by line?
Get professional reviewQuestions interviewers often ask for this role, with sample answers.
Upload your resume and we draft a letter for this exact role, tailored to what it asks for.
You will architect and drive package substrate design automation capabilities within the 3DIC Compiler platform to support next-generation AI and high-performance computing systems. Additionally, you will lead technical architecture reviews, mentor engineering teams, and implement production-grade algorithms for complex semiconductor packaging challenges.
Distinguished Engineer, Advanced Packaging Solutions
We Are
Synopsys delivers silicon-to-systems design solutions that help engineering teams build the next generation of AI-powered products. Our software, IP, simulation, and analysis platforms enable customers to solve complex design challenges across semiconductors, systems, and advanced packaging.
You Are
You have spent your career near the physical limits of semiconductor design, where architecture, manufacturability, and performance intersect. You understand that advanced packaging is now part of system architecture, not a downstream implementation step.
You think deeply about algorithms and data structures, but you have also shipped production software that real design teams depend on. At Synopsys, you will help shape package substrate design automation within 3DIC Compiler, enabling advanced multi-die systems for AI, high-performance computing, and heterogeneous integration.
What You'll Be Doing
The Impact You Will Have
What You'll Need
How You Think and Build
Why This Role Is Different
This is a chance to help define how engineering teams design, analyze, and sign off the next generation of multi-die systems. As AI, high-performance computing, and heterogeneous integration push beyond monolithic scaling, package architecture is becoming a primary driver of system performance.
You will have the technical latitude to build from first principles: smarter substrate automation, scalable routing, tighter analysis integration, and workflows that make advanced multi-die architecture practical for real design teams. For an engineer who wants to build rather than maintain, this role offers a visible imprint on a major transition in semiconductor design.
The Team You'll Be Part Of
You will be a key technical leader on the advanced packaging design automation team for 3DIC Compiler. The team is focused on package substrate design and the industry shift toward chiplet architectures and heterogeneous integration. Your work will directly shape the product roadmap and technical direction of a strategic Synopsys growth area.
Rewards and Benefits
Synopsys offers health, wellness, and financial benefits, including monetary and non-monetary rewards. Your recruiter will share compensation and benefits details during the hiring process.
At Synopsys, we want talented people of every background to feel valued and supported to do their best work. Synopsys considers all applicants for employment without regard to race, color, religion, national origin, gender, sexual orientation, age, military veteran status, or disability.
In addition to the base salary, this role may be eligible for an annual bonus, equity, and other discretionary bonuses. Synopsys offers comprehensive health, wellness, and financial benefits as part of a competitive total rewards package. The actual compensation offered will be based on a number of job-related factors, including location, skills, experience, and education. Your recruiter can share more specific details on the total rewards package upon request. The base salary range for this role is across the U.S.
Stop the endless job search. Our AI finds and applies to the best jobs for you.
Featuring 217,640+ Jobs in Architect
Answer easy questions
217,640+ jobs across 15+ categories
Get your best job matches
Only hand-screened, legit jobs
Find a remote job faster
No ads, scams, or junk
“I was the first applicant for a remote marketing position that got listed on the company website the same day I applied. Had an interview within 48 hours!”