Role Overview
We are looking for a highly skilled Staff Physical Design Engineer to drive end-to-end physical implementation for advanced semiconductor designs across cutting-edge technology nodes. The ideal candidate will lead block/subsystem-level implementation activities, collaborate cross-functionally with RTL, STA, DFT, and CAD teams, and ensure high-quality tape-outs with strong focus on power, performance, and area (PPA). This role requires deep expertise in physical design methodologies, debugging complex issues, and mentoring junior engineers.
What You’ll Do
- Lead full-chip or block-level physical design implementation from floorplanning to GDS signoff.
- Drive floorplanning, power planning, placement, CTS, routing, optimization, and physical verification closure.
- Analyze and optimize timing, congestion, IR drop, EM, and power for advanced technology nodes.
- Collaborate with RTL, DFT, STA, package, and CAD teams to resolve implementation and signoff challenges.
- Develop and improve physical design flows, automation scripts, and methodology enhancements.
- Support tape-out activities and ensure design signoff quality across all implementation stages.
- Mentor junior engineers and contribute to technical reviews and best practices.
What We’re Looking For
- Bachelor’s or Master’s degree in Electronics, Electrical Engineering, VLSI, or related field.
- 8+ years of hands-on experience in ASIC/SOC physical design implementation.
- Strong expertise in industry-standard EDA tools such as Cadence Innovus, Synopsys ICC2, PrimeTime, and StarRC.
- Solid understanding of timing closure, low-power design techniques, signal integrity, IR/EM analysis, and physical verification.
- Experience working on advanced technology nodes (7nm/5nm/3nm preferred).
- Strong scripting skills in Tcl, Perl, or Python for automation and flow enhancement.
- Excellent debugging, problem-solving, communication, and stakeholder collaboration skills.
Good to Have
- Experience with hierarchical and top-level SOC integration.
- Exposure to ML/AI-based design optimization methodologies.
- Knowledge of package-aware implementation and multi-die/chiplet architectures.
Success in This Role Looks Like
- Consistent delivery of high-quality physical design milestones with minimal schedule impact.
- Successful closure of timing, power, area, and reliability metrics for complex SOC designs.
- Proactive identification and resolution of implementation bottlenecks and signoff risks.
- Positive contribution to team productivity, methodology improvements, and mentoring initiatives.