Lead the implementation of complex digital SoCs from synthesis through tapeout, focusing on floorplanning, routing, and timing closure. Collaborate with cross-functional teams to ensure physical constraints align with design intent and mentor junior engineers.
Role Overview
We are looking for a Senior Physical Design Engineer to own and drive the implementation of complex digital SoCs from synthesis through tapeout. You will work at the intersection of design and process, translating RTL into silicon-ready layouts that meet aggressive PPA targets. This role exists to ensure our chips are not only functionally correct but physically optimized, manufacturable, and delivered on schedule.
What You'll Do
Lead floorplanning, placement, CTS, routing, and signoff for one or more design blocks or full-chip subsystems
Drive timing closure across multiple corners and modes using industry-standard EDA tools (Cadence Innovus, Synopsys ICC2, or equivalent)
Perform and interpret IR drop, EM, DRC, LVS, and antenna analyses; own resolution of violations
Collaborate with RTL designers, DFT, and verification teams to ensure physical constraints align with design intent
Work with foundry and PDK teams to validate design rules and address process-specific requirements
Contribute to methodology improvements — scripts, flows, and automation to improve turnaround time and quality of results
Mentor junior engineers and review their work at key implementation milestones
What We're Looking For
5+ years of hands-on physical design experience on advanced-node designs (16nm or below preferred)
Deep expertise in the full PD flow: floorplanning → placement → CTS → routing → signoff
Strong understanding of timing analysis, STA constraints (SDC), and multi-corner multi-mode (MCMM) closure
Proficiency with at least one major implementation tool suite (Cadence or Synopsys) and signoff tools (Tempus, PrimeTime, Voltus, RedHawk)
Solid grasp of low-power design techniques — power gating, multi-voltage domains, UPF/CPF
Experience working directly with foundry PDKs (TSMC, Samsung, or equivalent) through tapeout
Good to Have
Exposure to custom or mixed-signal blocks and interface IP integration (PCIe, DDR, USB)
Scripting proficiency in Tcl, Python, or Perl for flow automation
Prior experience in a tapeout lead or block owner role on a production chip
Success in This Role Looks Like
Blocks are delivered to signoff with PPA targets met — timing clean, no DRC/LVS violations, power within budget
Tapeout milestones are hit on schedule with minimal late-stage surprises or re-spins attributable to physical implementation
Flow and methodology improvements you drive measurably reduce runtime or improve QoR for the broader team
Junior engineers grow faster and make fewer critical mistakes because of your technical guidance and code/design reviews
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