Baya Systems

Lead and grow a distributed Field Applications Engineering team across Europe and APAC to drive technical adoption and design-wins for fabric interconnect IP. Manage the full customer lifecycle from pre-sales architectural reviews to post-sales technical escalation and support.

Drive and execute the communications strategy by translating complex semiconductor and chiplet concepts into compelling narratives. Manage multi-channel campaigns, brand voice, and sales collateral to accelerate design wins and pipeline growth.

Create comprehensive hardware documentation, including architecture specifications, integration guides, and data sheets for chip interconnect fabric IP. Translate complex RTL designs and microarchitecture specifications into clear technical manuals for customers.